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The US Defense Advanced Research Projects Agency (DARPA) has announced it is seeking collaboration partners to help shape the Next-Generation Microelectronics Manufacturing (NGMM) program – an effort to help usher in a new era of microchips and their future applications.
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DARPA intends for the program to pioneer revolutionary science and technology achievements that will propel the next major wave in the manufacture of high-performance microelectronics – specifically, through three-dimensional heterogeneous integration (3DHI).
The program is designed to establish state-of-the-art, domestic capability for research, development, and production of 3DHI microelectronics at an existing location. This centralised 3DHI accelerator will focus specifically on advancing groundbreaking research, development, and collaboration, and will include an accessible pilot line for prototyping and early production of emerging microelectronics.
Dr Dev Palmer, NGMM managing director at DARPA said, “Rapidly shifting geopolitics and the COVID-19 pandemic have highlighted the need for stronger domestic supply chains – including US microelectronics R&D, fabrication, packaging, and assembly.”
DARPA expects that the concept of 3DHI will be key to maintaining and expanding US technological leadership, ultimately with the foundational goal of NGMM: to achieve national-level, 3DHI-driven breakthroughs comprising novel design and engineering.
“Our goal is to strengthen long-term national security through trailblazing work in 3DHI that’s critical to technological superiority and sustains the US competitive advantage,” Dr Palmer explained.
NGMM is funded solely by the Defense Department budget and targets over-the-horizon advances in 3DHI and microelectronics complexities of tomorrow.
NGMM is currently making strides against a backdrop of broader government efforts to address domestic microelectronics fabrication, including the CHIPS and Science Act of 2022, which focuses on near-term, silicon-based microchips and semiconductor technologies.
NGMM is a cornerstone of ERI 2.0, a DARPA initiative to ensure domestic US leadership in cross-functional, future-focused microelectronics research, development, and manufacturing.
Built on collaboration with industry and academia, ERI 2.0 targets national-level microelectronics concerns through a thematic portfolio of programs aimed at US national security and economic interests.
