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Lockheed Martin has announced a partnership with Intel subsidiary Altera to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program spearheaded by the Pentagon.
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Driven by the US Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E), Lockheed Martin will develop a low-size, weight, and power (SWaP), Sensor Open Systems Architecture (SOSA)-aligned airborne electronic defence system, leveraging Altera’s Multi-Chip Package (MCP2) for expected use on the US Navy’s MH-60R multi-mission helicopter.
The project was awarded through the Naval Surface Warfare Center (NSWC) Crane Division Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) Other Transaction Agreement (OTA) vehicle and will be managed by the National Security Technology Accelerator (NSTXL).
Deon Viergutz, vice-president of spectrum convergence at Lockheed Martin, welcomed the announcement, saying, “We are excited to work with Intel, Altera, and OUSD to provide a revolutionary leap in defence systems capabilities, utilising high-performance US-built semiconductors.”
As a STAMP awardee, Lockheed Martin will advance the progression of technology to enable a defence system that detects and identifies threats with greater speed and accuracy at a significantly reduced SWaP and cost, freeing space for equipment to support other missions.
John Sotir, senior director, military aerospace and government business and State-of-the-Art Heterogeneous Integration Packaging (SHIP), Altera, added, “Through STAMP and our collaboration with Lockheed Martin, we’ve enabled the rapid development of vital defence systems to provide higher bandwidth and performance at low latency, lower power, and in a smaller footprint.”
Over the next 18 months, Lockheed Martin will integrate its latest SOSA technology with Altera’s semiconductors with the intent to ultimately implement, test, and complete production through the US Navy’s MH-60R helicopter program.
