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BAE Systems has been awarded a US$22 million (AU$33.6 million) contract by the US Office of the Undersecretary of Defense for Research & Engineering to support the US military’s Trusted & Assured Microelectronics program through Naval Surface Warfare Center.
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The contract will support the Strategic Transition of Microelectronics to Accelerate Modernisation by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project and will be managed by the National Security Technology Accelerator (NSTXL).
BAE Systems’ work under the STEAM PIPE project will result in the development and delivery of advanced chiplet prototypes that will transition into military systems. The technology will be made available to the entire US defence industrial base.
Wes Allen, director of microelectronics at BAE Systems’ FAST Labs, welcomed the contract, saying, “The highly specialised chiplets are small, modular pieces that can be combined to form a larger, more complex system-on-a-chip.
Work on the project, which builds on the technology advances of recent programs and follows a recently announced delivery milestone on the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program, includes collaboration with subcontractors Extoll GmbH and Comcores ApS.
“This is the beginning of a new chiplet ecosystem that could result in breakthroughs like enabling smaller form factor electronic warfare technology on new platforms,” Allen said.
BAE Systems’ FAST Labs research, development, and production portfolio addresses the ever-escalating challenges and threats faced by customers, including conducting in-depth research and a passion for new ideas. The FAST Labs group invent, innovate, adapt, and produce over-the-horizon technologies that continually give the US Department of Defense, US intelligence agencies, and our warfighters a decisive edge over all potential adversaries.
