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DARPA will work with the University of Texas at Austin to establish a consortium designed to unlock accessible prototyping for the chips of tomorrow with a new agreement to establish the first-ever national centre for advancing US-based microelectronics manufacturing.
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The Defense Advanced Research Projects Agency (DARPA) will work with the University of Texas at Austin’s existing Texas Institute for Electronics research centre to establish a consortium to support 3D heterogeneous integration (3DHI) microsystems research, development, and low-volume production as part of the US government’s Next-Generation Microelectronics Manufacturing (NGMM) program.
This latest stage builds on the program’s Phase 0 foundational research. NGMM’s next two phases will focus on a domestic capability that comprehensively addresses key challenges and strengthens US technological leadership and innovation at a time of increasing competition with the People’s Republic of China on microprocessors and microelectronics critical to national security.
Dr Whitney Mason, director of DARPA’s Microsystems Technology Office, welcomed this milestone achievement saying, “We’re holistically addressing tomorrow’s challenges and solutions. That starts with an onshore, open-access centre for 3DHI microsystems prototyping and pilot line manufacturing.”
The consortium is designed to leverage existing and new potential partnerships across the US defence industrial base, domestic foundries, vendors and start-ups, designers and manufacturers, members of academia, and other stakeholders to achieve a shared vision of national and economic security.
“This accessibility to researchers from academia, government, and industry will break down silos and foster an ecosystem that enhances the US competitive advantage,” Mason stated.
DARPA’s work in microelectronics R&D align with, but are separate from, broader government initiatives to secure microchip supply chains.
NGMM is funded by the US Defense Department budget, rather than the CHIPS and Science Act of 2022, aimed at near-term domestic semiconductor manufacturing. However, cross-collaboration remains integral to building onshore capacity.
Mason added, “We can’t overstate need for constant and unwavering forward momentum in microelectronics capabilities. The CHIPS Act’s near-term emphasis can help reinforce NGMM’s work toward realising the next major wave of microelectronics innovation.”
The US DOD identified and leverages a programmatic investment in over-the-horizon technologies for both national security and commercial applications – a key goal for NGMM.
“Supply chain resilience and reducing overseas reliance requires working together as a community, with both traditional and non-traditional members. That’s what this program is about,” Mason said.
